25G BOSA
Features：
1270nm/1330nm DML chip
Data rates up to 25Gbps
InGaAs PIN+TIA
T056 coaxial package
LC receptacle
Transmission distance up to 10km
Case operating Temperature: -5℃~+75℃
Applications:
Telecom System & Datacom System
SFP+
1270nm/1330nm DML chip
Data rates up to 25Gbps
InGaAs PIN+TIA
T056 coaxial package
LC receptacle
Transmission distance up to 10km
Case operating Temperature: -5℃~+75℃
Applications:
Telecom System & Datacom System
SFP+
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